Ceramics Semiconductor Grinding Machine UF-033
The ease of use is appealing.
This is a newly developed outer diameter grinding machine designed with the shaping of sapphire substrate ingots in mind. It features high-efficiency processing based on the "cylindrical three-dimensional grinding method" and user-friendly aspects such as hydraulic work clamping. It is designed with end-face reference centering in mind, which strengthens the workpiece axis compared to conventional machines. It also demonstrates its capabilities in processing semiconductors like silicon carbide and various ceramics. By adding the OF processing option, it can perform both outer diameter and OF processing with a single machine.
- Company：マシンクラフト
- Price：Other
